Riber's MPVD 300 is an innovative, modular, ultra-high-vacuum system for depositing incredibly thin, highly uniform films in an ultra-pure, ultra-clean environment.
Compatible with SEMI standards, the MPVD 300 module can be integrated with 300 mm silicon deposition tools to provide a vast range of ultra-thin films with sharp, accurate interfaces. Materials for forming these incredibly thin layers are provided by evaporation ports, an electron beam evaporator unit and a large-beam RF plasma cell.
An additional module is available from Riber, which can be integrated into the silicon process line and flips the wafer from face-down, the orientation in the MPVD 300, to face-up, the standard orientation used in silicon
For more information, please contact Riber.
- Up to 300 mm wafer
- Egun and cell/sources