Substrate Holders / Platens

Details

  • Easy setting
  • Uniform temperature distribution
  • Top quality materials – contamination free
  • Oxygen-resistant version available
  • Broad range of multi-wafer platens

Presentation

Riber provides a broad range of substrate holders from the use of small pieces of wafer to multi-wafer mounting with and without indium or gallium bounding.

Multi-wafer holders are designed to allow for the positioning of wafers very easily and in the shortest possible time; they are dedicated to vertical growth chamber geometries, on which wafers are held by gravity.

By design, wafer holders allow for RHEED investigations without shadows cast by the wafer fixing system.

Substrate holders are mainly made of molybdenum ensuring high purity and top quality for operations at above 150°C. Other materials, such as graphite or steel, can be used upon request. No particles are generated during transfer operations. For standard applications, wafers may be mounted in two ways: on a blank platen, using indium bonding material, or on a holder with holes adapted to the wafer size, for indium-free mounts.

To achieve excellent temperature uniformities, Riber recommends the use of high uniformity rings placed on top of the wafer to optimize heat distribution from the substrate oven. Even for high temperature processes, temperatures superior to 800°C, multi-wafer holders have excellent dislocation-free and stress-free thermal behavior.

Layout

Technical information

Characteristics Compact 21 CLS Compact 21 Series MBE 412 MBE49 MBE6000
Platen diameter (mm) 77,3 100 126,2 242 270 (squared « corners ») 400
Platen capacity Blank
1x 2’’
1x ¼ 3’’
1x ¼ 2’’
Blank
1x 3’’
1x 2’’
1x ¼ 3’’
1x ¼ 2’’
Blank
1x 4’’
1x 3’’
3x 2’’
1x 2’’
1x ¼ 3’’
1x ¼ 2’’
1x 8’’
1x 6’’
3x 4’’
5x 3’’
5x 3’’ + 1x 2’’
3x 3’’
1x 3’’
8x 2’’
1x 2’’
1x 6’’
4x 4’’
3x 4’’
1x 4’’
5x 3’’
5x 3’’ + 1x 2’’
4x 3’’
14x 2’’
13x 2’’
11x 2’’
8x 2’’
1x 8’’
4x 6’’
9x 4’’
15x 3’’
32x 2’’
Standard thickness (mm) 3 4
Typical platen material Mo

For special configurations (platenholder materials, number of wafers, square wafers, thicknesses,…), please consult Riber

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